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Xmems Labs introduces tiny fans on chips for micro-cooling
Xmems Labs unveiled its "fan on a chip" micro-cooling components for actively cooling smartphones, tablets and other mobile devices.
Dubbed piezoMEMS, the tech has now been adapted for use in the company’s Xmems XMC-2400 µCooling chip, the first-ever all-silicon,active micro-cooling fan for ultramobile devices and next-generation artificial intelligence (AI) solutions. “Thermal management in ultramobile devices, which arebeginning to run even more processor-intensive AI applications, is a massive challenge for manufacturersand consumers. These devices are passively cooled now using heat spreaders or vapor chambers because they can’t fit traditional fans, which are typically three millimeters or more in thickness, or three times the size of the micro-cooling solution.
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