D-Matrix Raptor 3D-DRAM Accelerator for Generative Inference at Hot Chips 2026
Infineon RISC-V for Automotive at Hot Chips 2026
Canonical Evolution of Enterprise Open Source RISC-V at Hot Chips 2026
Update on RISC-V Standards and Adoption at Hot Chips 2026
NVIDIA RISC-V for NVIDIA GPUs at Hot Chips 2026
Hot Chips 2026: Samsung reveals a three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the processor
Hot Chips 2026: Cerebras lays out the future of wafer-scale AI — Nexus system architecture triples rack-scale performance, CS-6 wafer to incorporate stacked DRAM
Hot Chips 2026: OpenAI's Jalapeño AI ASIC unpacked — accelerator developed using AI achieves efficiency and throughput gains against power-hungry Blackwell
Oxmiq Labs HBF in AI Compute at Hot Chips 2026
Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card — TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed die
Hot Chips 2026: Arm details AGI server CPU with two 70-core N3P chiplets — touts 2 TB/s UCIe fabric link and 12-channel memory controller
Hot Chips 2026: Nvidia presents Groq 3 LPX architecture and unveils its first third-party inference benchmark — LP30-based rack already in production, company says
Hot Chips 2026: Nvidia touts benefits of its DSX MaxLPS site power management approach — tech allows for more compute from fixed data center power budgets
Hot Chips 2026: Fujitsu's Monaka CPU stacks its entire cache on a separate 5nm die and narrows to 256-bit SVE2 — 350W and 500W SKUs due in 2027
Hot Chips 2026: High Bandwidth Flash promises massive bandwidth and capacity, but its usability is extremely limited — new memory format strikes a balance between HBM and NAND flash
Hot Chips 2026: Nvidia breaks down 88-core Vera CPU — spatial multithreading benchmarked, 1.2 TB/s SOCAMM2 memory, agentic workloads detailed, and more
Hot Chips 2026: Samsung makes LPDDR5X smart with logic unit in memory — LPDDR5X-PIM is 3.01x faster than LPDDR5X in AI inference with 8x the bandwidth
Hot Chips 2026: Intel details cutting-edge tech in entry-level Wildcat Lake — value-focused 18A chips necessitated UCIe integration
Hot Chips 2026: Micron warns HBM wafer penalty is widening with every generation — AI memory uses 3x more silicon than DDR5, company says memory wall is 'getting worse' as prices rise
Hot Chips 2026: Intel dives deep on Crescent Island AI accelerator — larger caches and deeper XMX engines target maximum AI FLOPS per watt
