Hot Chips 2026: OpenAI's Jalapeño AI ASIC unpacked — accelerator developed using AI achieves efficiency and throughput gains against power-hungry Blackwell
Hot Chips 2026: Cerebras lays out the future of wafer-scale AI — Nexus system architecture triples rack-scale performance, CS-6 wafer to incorporate stacked DRAM
Oxmiq Labs HBF in AI Compute at Hot Chips 2026
Hot Chips 2026: Arm details AGI server CPU with two 70-core N3P chiplets — touts 2 TB/s UCIe fabric link and 12-channel memory controller
Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card — TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed die
Hot Chips 2026: Nvidia presents Groq 3 LPX architecture and unveils its first third-party inference benchmark — LP30-based rack already in production, company says
Hot Chips 2026: Nvidia touts benefits of its DSX MaxLPS site power management approach — tech allows for more compute from fixed data center power budgets
Hot Chips 2026: Fujitsu's Monaka CPU stacks its entire cache on a separate 5nm die and narrows to 256-bit SVE2 — 350W and 500W SKUs due in 2027
Hot Chips 2026: High Bandwidth Flash promises massive bandwidth and capacity, but its usability is extremely limited — new memory format strikes a balance between HBM and NAND flash
Hot Chips 2026: Nvidia breaks down 88-core Vera CPU — spatial multithreading benchmarked, 1.2 TB/s SOCAMM2 memory, agentic workloads detailed, and more
Hot Chips 2026: Samsung makes LPDDR5X smart with logic unit in memory — LPDDR5X-PIM is 3.01x faster than LPDDR5X in AI inference with 8x the bandwidth
Hot Chips 2026: Intel details cutting-edge tech in entry-level Wildcat Lake — value-focused 18A chips necessitated UCIe integration
Hot Chips 2026: Micron warns HBM wafer penalty is widening with every generation — AI memory uses 3x more silicon than DDR5, company says memory wall is 'getting worse' as prices rise
Hot Chips 2026: Intel dives deep on Crescent Island AI accelerator — larger caches and deeper XMX engines target maximum AI FLOPS per watt
OpenAI Jalapeno Custom AI ASIC at Hot Chips 2026
Google’s TPUv8s for Training and Inference at Hot Chips 2026
SambaNova’s SN50 RDU for AI at Hot Chips 2026
Microsoft’s Maia 200 AI Accelerator at Hot Chips 2026
Cerebras Talks Going Rack-Scale with Their WSEs at Hot Chips 2026
NVIDIA’s Groq 3 LPU Accelerators for Heterogeneous AI Compute at Hot Chips 2026
