Samsung and SK Hynix are jacking up DRAM prices by as much as 70 percent
Micron secures $318 million Taiwanese subsidy for HBM R&D as AI memory arms race intensifies — three-year project aims to develop leading-edge, high-performance memory
SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains
